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漢民微測自成立於 1998 年以來就致力於研發最先進的電子束檢測技術來協助提升半導體產業之良率。目前漢民微測已經成為世界各大晶圓代工廠與晶圓記憶體廠最大的電子束檢測設備供應商。我們擁有自行研發專利的電子槍技術 、 電子束成像技術與精準的檢測軟體 ， 來確保我們的每條產品線-eScan® 系 列、ePTM 系 列、eXplore®系列皆能滿足半導體研發部門與量產單位之各項應用。 |
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漢民微測致力於開發出最先進的技術來滿足目前及未來的半導體產業需求。我們不只設計與製造最好的設備，
還緊密地與客戶共同合作讓我們的技術發揮最大的價值，並且發展出半導體產業最佳生產力的漢民微測檢測設
備。客戶滿意永遠是我們最重視的服務。 |
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Inspection_of_32nm_Imprinted_Patterns_with_an_Advanced_E-beam_Inspection_System,Proceedings_of_the_SPIE,Volume7488,pp.74881V-74881V-11(2009)
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1895.52 KB
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Investigation_and_Solution_of_Bump-like_Killer_Defects,_International_Symposium_Semiconductor_Manufacturing_2008
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1839.41 KB
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Leakage_Monitoring_and_Control_with_an_Advanced_e-Beam_Inspection_System,Proceedings_of_the_SPIE,Volume6152,pp.1380-1388(2006)
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829.38 KB
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Low_Energy_Large_Scan_Field_Electron_Beam_Column_for_Wafer_Inspection,Journal_of_Vacuum_Science_and_Technology_BMicroelectronics_and_Nanometer_Structure,Nov.2004,Vol.22,pp.3534-3538
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210.98 KB
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Optical_Beam_Enhanced_Defect_Detection_With_Electron_Beam_Inspection_Tools,International_Symposium_Semiconductor_Manufacturing_2008
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284.32 KB
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Study_of_ADI(After_Develop_Inspection)_On_Photo_Resist_Wafers_Using_Electron_Beam(Ⅲ),Proceedings_of_the_SPIE,Volume_6922,pp.69223E-69223E-12(2008)
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687.33 KB
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Study_of_ADI(After_Develop_Inspection)_On_Photo_Resist_Wafers_Using_Electron_Beam(II),Proceedings_of_the_SPIE,Volume6518,pp.65184C(2007)
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376.87 KB
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Study_of_ADI(After_Develop_Inspection)_Using_Electron_Beam,Proceedings_of_the_SPIE,Volume6152,pp.1372-1379(2006)
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1062.75 KB
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Study_of_Devices_Leakage_of_45nm_node_with_Different_SRAM_Layouts_Using_an_Advanced_e-beam_Inspection_Systems,Proceedings_Vol.7272,Metrology,Inspection,and_Process Control_for_Microlithography_XX
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Study_of_Program_Defects_of_22nm_Nano_Imprint_Template_with_an_Advanced_e-beam_Inspection_System,Proceedings_Vol.7488,Photomask_Technology_2009
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