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漢民微測自成立於 1998 年以來就致力於研發最先進的電子束檢測技術來協助提升半導體產業之良率。目前漢民微測已經成為世界各大晶圓代工廠與晶圓記憶體廠最大的電子束檢測設備供應商。我們擁有自行研發專利的電子槍技術 、 電子束成像技術與精準的檢測軟體 ， 來確保我們的每條產品線-eScan® 系 列、ePTM 系 列、eXplore®系列皆能滿足半導體研發部門與量產單位之各項應用。 |
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Description :
eP™series is the first e-beam hotspot process monitoring inspection system. eP™3xp offers highest detection sensitivity to electrical and physical defects suitable for both early R&D and in-line monitoring in mass production fabs. eP™3xp’s leading-edge image resolution and LFOV ( Large Field of View) enables effective pattern verification application such as OPC error and CDU measurement.
Value Proposition : |
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| eP™ Series |
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 An e-beam hotspot/weak-point process monitoring system
 with high throughput.
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An e-beam hotspot/weak-point process monitoring system that enables quick characterization of full
wafer property.
An e-beam hotspot/weak-point process monitoring system offers the highest VC and physical sensitivity.
An e-beam hotspot/weak-point process monitoring system with the lowest CoO.
An e-beam system with capability to measure CDU on an array of 2D structures, such as gate and AA of
SRAM array.
The eManager™ ADC system with the most advanced defect binning algorithm. |
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Applications :
eP™ series handles systematic variation of electrical and physical properties on the wafer surface. The typical application includes contact non-open, OPC error, piping, bridge, broken line and more for hotspot /weak-point processes monitoring. It is also very useful for defect inspection and characterization at early stage of R&D when defect density is very high. 2D CDU capability could allow customers to quickly identify the center of the photolithography process window. |
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