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漢民微測自成立於 1998 年以來就致力於研發最先進的電子束檢測技術來協助提升半導體產業之良率。目前漢民微測已經成為世界各大晶圓代工廠與晶圓記憶體廠最大的電子束檢測設備供應商。我們擁有自行研發專利的電子槍技術 、 電子束成像技術與精準的檢測軟體 ， 來確保我們的每條產品線-eScan® 系 列、ePTM 系 列、eXplore®系列皆能滿足半導體研發部門與量產單位之各項應用。 |
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Description :
eScan® series of e-beam inspection systems is designed for advanced wafer manufacturers. With the advent of eScan®, defectivity baseline in advanced fabs is being recalibrated. eScan® offers fast yield enhancement with the smallest e-beam inspection pixel size, highest sensitivity to DOI, and high-resolution imaging for inspection. Crystal clear on-tool review images effectively reduce the time-to-result cycle by eliminating most review SEM requirements.
eScan® 320xp e-beam inspection system captures tiny physical defect and VC (Voltage Contrast) defects with HMI patented resolution enhancement |
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| eScan®Series |
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| electron gun. eScan® 320xp’s LeapNScan™ technology with LFOV ( Large Field of View) and WWDS ( Whole Wafer Die Sampling ) provides effectively flexibility for process monitoring. eScan® 400xp with continuous scan e-beam inspection system provides most cost effective solution with balanced sensitivity and throughput for advanced memory and logic fabs. |
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eScan® 500 :
eScan®500 is the next generation model for the current flagship models eScan®320 and eScan®400. Faced with the continuing miniaturization demands of the manufacturing processes of the semiconductor customers, the image resolution of the eScan®500 is enhanced by more than 30% compared to the eScan®320. At the same time, it bundles a more flexible "LeapNScan™" scanning system with the Continuous Scan system |
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Value Proposition :
 An EBI system with a longest life time for advanced fabs.
An EBI system with the highest sensitivity to DOI ( defect of interest ) signature detection.
An EBI system with the most reliable data and the highest defect location matching.
An EBI system offering the highest confidence level on advanced device analysis.
An EBI system with HMI's unique advanced charge control capability.
The eManager™ ADC system with the most advanced defect binning algorithm. |
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Applications :
eScan® is capable of generating defectivity baseline for both physical and electrical defects. eScan®'s main applications include : Front-end of line at Salicide, HKMG and FinFET; Mid-end of line at contact ACI and WCMP; and Back-end of line at Via ACI and Cu-CMP, etc. |
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