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Established in 1998, Hermes Microvision Inc.(HMI) has been committed to the research and development of the most advanced E-beam Inspection (EBI) tools and solutions for the leading semiconductor manufacturing fabs. Today, HMI is the leading supplier of EBI tools for both foundry and memory fabs worldwide. Based on our proprietary electron gun and column technologies and highly effective defect inspection algorithms, we deliver multiple product lines, including eScan® Series / ePTM Series / eXplore® Series, for various R&D and production applications.
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HMI is committed to develop the most advanced inspection technologies to meet today and future semiconductor manufacturing's needs. Rather than just design and build tools, we also work closely with our customers to maximize the values of our technologies and enhance the productivity of HMI's inspection tools of the fabs. Customer satisfaction is our number one priority. |
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Inspection_of_32nm_Imprinted_Patterns_with_an_Advanced_E-beam_Inspection_System,Proceedings_of_the_SPIE,Volume7488,pp.74881V-74881V-11(2009)
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1895.52 KB
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Investigation_and_Solution_of_Bump-like_Killer_Defects,_International_Symposium_Semiconductor_Manufacturing_2008
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1839.41 KB
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Leakage_Monitoring_and_Control_with_an_Advanced_e-Beam_Inspection_System,Proceedings_of_the_SPIE,Volume6152,pp.1380-1388(2006)
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829.38 KB
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Low_Energy_Large_Scan_Field_Electron_Beam_Column_for_Wafer_Inspection,Journal_of_Vacuum_Science_and_Technology_BMicroelectronics_and_Nanometer_Structure,Nov.2004,Vol.22,pp.3534-3538
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210.98 KB
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Optical_Beam_Enhanced_Defect_Detection_With_Electron_Beam_Inspection_Tools,International_Symposium_Semiconductor_Manufacturing_2008
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284.32 KB
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Study_of_ADI(After_Develop_Inspection)_On_Photo_Resist_Wafers_Using_Electron_Beam(Ⅲ),Proceedings_of_the_SPIE,Volume_6922,pp.69223E-69223E-12(2008)
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687.33 KB
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Study_of_ADI(After_Develop_Inspection)_On_Photo_Resist_Wafers_Using_Electron_Beam(II),Proceedings_of_the_SPIE,Volume6518,pp.65184C(2007)
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376.87 KB
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Study_of_ADI(After_Develop_Inspection)_Using_Electron_Beam,Proceedings_of_the_SPIE,Volume6152,pp.1372-1379(2006)
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1062.75 KB
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Study_of_Devices_Leakage_of_45nm_node_with_Different_SRAM_Layouts_Using_an_Advanced_e-beam_Inspection_Systems,Proceedings_Vol.7272,Metrology,Inspection,and_Process Control_for_Microlithography_XX
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1216.31 KB
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Study_of_Program_Defects_of_22nm_Nano_Imprint_Template_with_an_Advanced_e-beam_Inspection_System,Proceedings_Vol.7488,Photomask_Technology_2009
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2265.83 KB
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