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Established in 1998, Hermes Microvision Inc.(HMI) has been committed to the research and development of the most advanced E-beam Inspection (EBI) tools and solutions for the leading semiconductor manufacturing fabs. Today, HMI is the leading supplier of EBI tools for both foundry and memory fabs worldwide. Based on our proprietary electron gun and column technologies and highly effective defect inspection algorithms, we deliver multiple product lines, including eScan® Series / ePTM Series / eXplore® Series, for various R&D and production applications.
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HMI is committed to develop the most advanced inspection technologies to meet today and future semiconductor manufacturing's needs. Rather than just design and build tools, we also work closely with our customers to maximize the values of our technologies and enhance the productivity of HMI's inspection tools of the fabs. Customer satisfaction is our number one priority. |
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65 nm Photolithography Process Window Qualification Study with Advanced e-beam Metrology and Inspection Systems, Proceedings of the SPIE, Volume 6152, pp. 1470-1479 (2006)
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1180.1 KB
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After Development Inspection (ADI) Studies of Photo Resist Defectivity of an Advanced Memory Device, Proceedings of the SPIE, Volume 7520, pp. 75200J-75200J-11 (2009)
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1135.38 KB
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Contact Leakage and Open Monitoring with an Advanced E-beam Inspection System, Proceedings of the SPIE, Volume 6518, pp. 65184I (2007)
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743.76 KB
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Effects of WCMP Process on Surface Charging Mode of Electron Beam Inspection, International Symposium Semiconductor Manufacturing 2006
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1354.07 KB
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Enhancement of Voltage Contrast Inspection Signal Using Scan Direction, International Symposium Semiconductor Manufacturing 2007
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1358.6 KB
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Enhancing Thin Dielectric Remaining Detection Under Polysilico Plug of Advanced DRAM by Electron Beam Inspection, International Symposium Semiconductor Manufacturing 2007
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2329.45 KB
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EUV mask pattern inspection with an advanced electron beam inspection system, Proceedings Vol. 7520, Lithography Asia 2009
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2471.82 KB
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High-throughput Contact Critical Dimension and Gray Level Value Measurement, Proceedings of the SPIE, Volume 6152, pp. 1171-1177 (2006)
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511.11 KB
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In-line Semi-electrical Process Diagnosis Methodology for Integrated Process Window Optimization of 65nm and below Technology Nodes, Proceedings of the SPIE, Volume 6152, pp. 642-649 (2006)
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416.49 KB
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Inspection and Repair for Imprint Lithography at 32nm and below, Proceedings of the SPIE, Volume 7379 (2009)., pp. 73790N-73790N-12 (2009)
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