Established in 1998, Hermes Microvision Inc.(HMI) has been committed to the research and development of the most advanced E-beam Inspection (EBI) tools and solutions for the leading semiconductor manufacturing fabs. Today, HMI is the leading supplier of EBI tools for both foundry and memory fabs worldwide. Based on our proprietary electron gun and column technologies and highly effective defect inspection algorithms, we deliver multiple product lines, including eScan^® Series / eP^TM Series / eXplore^® Series, for various R&D and production applications.

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About HMI

Research & Development

The research and development center of Hermes Microvision, Inc. was founded in Silicon Valley in 1998. Led by four top scientists specializing in core technologies of Physics, Electron Optics, Image Processing, Software, Mechanical Structure, Electronics and Control, our solid R & D team is constituted of professionals and elites from Taiwan, China and around the world. Committed to finding solutions to problems in manufacturing next-generation semiconductors, this team also places emphasis on developing world-class cutting-edge semiconductor processing tools with advanced technologies.

1.	High Resolution
	LeapNscan inspection mode is to scan the wafer while stage is stopped. Accompany with high resolution e-Optic system, LeapNscan inspection mode may achieve the highest resolution in the market. The minimum inspection pixel size is down to 5nm (eScan^®320xp model) to support 16nm and beyond logic device process development and production. Also through eScan high resolution, the patch image shows clear pattern and location of defects and so the users will not necessarily review each defect. If it is a must to do high resolution review, the review can be done at the same time by eScan without spending extra time and effort to review in REVIEW SEM.

2.	Inspection Flexibility
	E-beam inspector provides users the most flexibility in use to only have inspection on critical areas, such as IC SRAM area where process most likely has issues and exclude inspection in non-critical areas. Furthermore, after doing WWDS (Whole Wafer Die Sampling) and setup defect database, the distribution of IC defects can be easily caught in even shorter time with HMI’s continuous inspection system.

3.	High Sensitivity
	eScan has high sensitivity in detecting the weak VC defects in IC Front-end process, such as in CT_AEI. In CONTWCMP, PMOS short and NMOS leakage can be detected. Or, NMOS short and PMOS leakage can be captured by inspection with obtaining the negative charge on the wafer surface in CONTWCMP. eScan can contribute great practical value in low leakage development and production for 28nm generation or under.

4.	Good Product Extendibility
	eScan^®320, the first e-beam inspection tool by HMI has great extendibility while the technology node is narrowing down gradually. Currently, in some customer site, one eScan meets the customers' requirements for production and advanced developments in generations from 28nm down to 16nm to increase the tool utilization efficiently and lower the cost. Customers do not have to purchase new advanced equipments often but use the same tool for production of new generation products and developments.

5.	High System Matching Capability and Stability
	For multiple tools user, HMI had spent time in enhancing tool matching capability and raising inspection accuracy through different aspects, tool design, production and manufacture. Now, HMI eScan defect inspector is capable of meeting the customers' expectation to have high matching rate and stability among all eScan tools in one Fab.

Hermes Microvision, Inc. devotes to develop the core technologies of Electron Optics and the application of system innovation and integration; provides customers solution of product yield enhancement form all directions to satisfy customers requirements. Up to date Hermes Microvision, Inc. has been becoming a top leading provider of the electron beam wafer inspection tool of the globe. Hermes Microvision, Inc. will keep on products research and development; provides more mature equipment and technology support for customer; and assists all semiconductor manufacturers around the world making products with the highest quality and efficiency in the future.